

🔩 Master your solder game with Rubik’s precision paste!
Rubik Lead-Based BGA Rework Solder Paste (50g) features a tin-lead alloy optimized for mobile phone repair, chip planting, and electronic component soldering. Its controlled viscosity and graininess deliver consistent, high-quality solder joints, making it a trusted choice for professional BGA rework and precision electronics tasks.
| Manufacturer | Rubik |
| Item Weight | 60 g |
| Package Dimensions | 11.4 x 9.6 x 3 cm; 60 g |
| Item model number | RBJSD-18S |
Trustpilot
1 month ago
2 weeks ago
3 weeks ago
1 week ago